Silicon nitride handle ring

Application: Semiconductor field. Performance characteristics: high thermal conductivity, light weight, insulation, wear resistance and other properties.
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Silicon nitride handle ring has dense, high hardness, high wear resistance of physical properties, as well as good heat resistance, excellent mechanical strength, high temperature environment still has good insulation, good corrosion resistance and other physical properties, is used to make semiconductor equipment mechanical handling arm of the excellent material.


Advantages of silicon nitride handle ring products:


High strength


High hardness: the semiconductor mechanical handling arm generally uses high-purity aluminum oxide, the purer the purity of aluminum oxide, the higher the strength


High density


Good wear resistance


Good heat resistance


Good mechanical strength: hardness close to corundum, self-lubricating wear. The bending strength at room temperature can be as high as 980MPa or more, which can be compared with alloy steel, and the strength can be maintained until 1200° without decreasing.


Good electric edge performance: room temperature resistivity of 1015Ω·cm, insulation strength of 15kV/mm.


High melting point: the melting point is 2050℃, when the semiconductor is heat treated, the thermal deformation of silicon nitride ceramics is also less, which reduces the deformation of semiconductor parts during heat treatment.


Excellent chemical stability: The chemical properties of silicon nitride ceramics are stable, and will not leave small particles with pollution and charged charges on the contact items, will not produce metal ions, and will not pollute semiconductor parts.


Silicon nitride handle ring  performance indicators :

Performance

Density/(g/cm³)

3.15≤ρ≤3.25

Elastic modulus/GPa

270≤E≤330

Poisson's ratio

0.23≤μ≤0.29

Coefficient of thermal expansion (room temperature to 500℃)/X10-6/℃

2.0≤α≤3.7

Bending strength/MPa

Four-point test

≥750

≥650

≥530


Three-point test

≥820

≥720

≥550

Vickers hardness(HV)

≥1420

≥1330

≥1270

Fracture toughness

≥6

≥5

≥5

Crushing load ratio

40%

35%

30%

microcosmic structure

Air hole/μm

≤10

≤10

≤25

Inclusion

25<S≤50

≤4

≤8

≤16

50<S≤100

≤1

≤2

≤4

100<S≤200

0

≤1

≤25

S>200

0

0

≤1


Ceramic product processing accuracy :

Item

Precision value

Dimensional exact values

Up to 0.001mm

Degree of finish

Up to mirror

The number of concentricities

Up to 0.003mm

The number of parallelism

Up to 0.002mm

Bore tolerance

The minimum can be machined 0.005mm

Straight groove

The narrowest machined groove is 0.1*100mm

Thickness dimension

Minimum machining to 0.08mm

Screw thread

Min machining inner thread M2, outer thread no limited

Cylindricity dimension

Up to 0.004mm

Linear tolerance

Up to 0.001mm

Min aperture

The minimum processing capacity is 0.07mm


Applications : Excellent material for making mechanical arms for semiconductor devices.