Silicon nitride handle ring has dense, high hardness, high wear resistance of physical properties, as well as good heat resistance, excellent mechanical strength, high temperature environment still has good insulation, good corrosion resistance and other physical properties, is used to make semiconductor equipment mechanical handling arm of the excellent material.
Advantages of silicon nitride handle ring products:
High strength
High hardness: the semiconductor mechanical handling arm generally uses high-purity aluminum oxide, the purer the purity of aluminum oxide, the higher the strength
High density
Good wear resistance
Good heat resistance
Good mechanical strength: hardness close to corundum, self-lubricating wear. The bending strength at room temperature can be as high as 980MPa or more, which can be compared with alloy steel, and the strength can be maintained until 1200° without decreasing.
Good electric edge performance: room temperature resistivity of 1015Ω·cm, insulation strength of 15kV/mm.
High melting point: the melting point is 2050℃, when the semiconductor is heat treated, the thermal deformation of silicon nitride ceramics is also less, which reduces the deformation of semiconductor parts during heat treatment.
Excellent chemical stability: The chemical properties of silicon nitride ceramics are stable, and will not leave small particles with pollution and charged charges on the contact items, will not produce metal ions, and will not pollute semiconductor parts.
Silicon nitride handle ring performance indicators :
Performance | Ⅰ | Ⅱ | Ⅲ | ||
Density/(g/cm³) | 3.15≤ρ≤3.25 | ||||
Elastic modulus/GPa | 270≤E≤330 | ||||
Poisson's ratio | 0.23≤μ≤0.29 | ||||
Coefficient of thermal expansion (room temperature to 500℃)/X10-6/℃ | 2.0≤α≤3.7 | ||||
Bending strength/MPa | Four-point test | ≥750 | ≥650 | ≥530 | |
Three-point test | ≥820 | ≥720 | ≥550 | ||
Vickers hardness(HV) | ≥1420 | ≥1330 | ≥1270 | ||
Fracture toughness | ≥6 | ≥5 | ≥5 | ||
Crushing load ratio | 40% | 35% | 30% | ||
microcosmic structure | Air hole/μm | ≤10 | ≤10 | ≤25 | |
Inclusion | 25<S≤50 | ≤4 | ≤8 | ≤16 | |
50<S≤100 | ≤1 | ≤2 | ≤4 | ||
100<S≤200 | 0 | ≤1 | ≤25 | ||
S>200 | 0 | 0 | ≤1 |
Ceramic product processing accuracy :
Item | Precision value | ||||
Dimensional exact values | Up to 0.001mm | ||||
Degree of finish | Up to mirror | ||||
The number of concentricities | Up to 0.003mm | ||||
The number of parallelism | Up to 0.002mm | ||||
Bore tolerance | The minimum can be machined 0.005mm | ||||
Straight groove | The narrowest machined groove is 0.1*100mm | ||||
Thickness dimension | Minimum machining to 0.08mm | ||||
Screw thread | Min machining inner thread M2, outer thread no limited | ||||
Cylindricity dimension | Up to 0.004mm | ||||
Linear tolerance | Up to 0.001mm | ||||
Min aperture | The minimum processing capacity is 0.07mm |
Applications : Excellent material for making mechanical arms for semiconductor devices.