Electronic substrate The main circuit board substrate, widely used in the electronics manufacturing industry. Silicon nitride electronic substrate, mainly used in silicon nitride insulation, thermal conductivity. Ultra-large scale integrated circuits, electronic chips, etc., due to the large amount of calculation and heat generation, the requirements for insulation and heat dissipation are getting higher and higher, and silicon nitride electronic substrates are excellent to solve this problem.
Advantages of silicon nitride electronic substrate :
High temperature stability: Silicon nitride is able to maintain stable physical and chemical properties at high temperatures, making it an ideal substrate material for high-temperature electronic devices and sensors.
Corrosion resistance: Silicon nitride has good corrosion resistance to a variety of chemicals and is suitable for applications in harsh environments.
High mechanical strength: Silicon nitride has high hardness and mechanical strength, and can withstand greater pressure and impact.
High thermal conductivity: The thermal conductivity of aluminum nitride is much higher than that of traditional ceramic materials, making it ideal for electronic devices that require efficient heat dissipation.
Electrical insulation: Aluminum nitride has good electrical insulation properties and is suitable for application scenarios that require electrical isolation.
Low coefficient of thermal expansion: The coefficient of thermal expansion of aluminum nitride is low, which means that when the temperature changes, the size of the material changes less, which is conducive to improving the stability and reliability of electronic equipment.
Silicon nitride electronic substrate performance indicators :
Parameters | Silicon nitride electronic substrate | unit | |||
Density/(g/cm³) | >3.2 | g/cm³ | |||
Dimensions | 190.5*138±0.05 | mm | |||
Thickness | 0.32±0.02 | mm | |||
Camber | ≤0.03% | mm | |||
Surface roughness | ≤0.7 | μm | |||
Thermal expansion coefficient | 2.6~3.4 | 10-6K,40-400℃ | |||
Fracture toughness | 6.0~7.0 | Mpa.m1/2 | |||
Thermal Conductivity | 80~90 | W/(m.K),25℃ | |||
Bending strength | >700 | Mpa | |||
Breakdown strength | >15 | (KV.mm) | |||
Dielectric constant | 8 | 1Mhz | |||
Volume Resistivity | >1014 | Ω.cm,25℃ |
Silicon nitride electronic substrate applications:
In the electronics industry
They are often used as substrates for high-performance electronic devices and integrated circuits.
In the aerospace sector
Due to their high temperature and corrosion resistance, they are used in the manufacture of key components for aircraft and rockets.
In the fields of medical devices, chemical equipment and automotive manufacturing: silicon nitride substrates also play an important role