Silicon nitride grading wheel is a grinding wheel made of silicon nitride abrasive, and its particle size and shape can be graded according to processing requirements, which is often used in the grinding and polishing process of silicon wafers.
Advantages of silicon nitride grading wheel :
High hardness: silicon nitride abrasive has a high hardness, up to 2800-3300kg/mm², several times higher than the general abrasive, so it can better meet the high-precision processing requirements for the surface of silicon wafers.
Strong wear resistance: the wear resistance of silicon nitride abrasives is better than that of general abrasives, and it can maintain a higher grinding efficiency for a longer time, reducing the processing cost and frequency.
Particle size grading: The abrasive particle size and shape of the silicon nitride grading wheel can be graded according to the processing requirements, which can meet the processing needs of different precision and finish.
High temperature stability: silicon nitride abrasive has high thermal stability, that is, it can still maintain good hardness and grinding effect at high temperature, and is suitable for high temperature processing environment.
silicon nitride grading wheel performance indicators :
Performance | Ⅰ | Ⅱ | Ⅲ | ||
Density/(g/cm³) | 3.15≤ρ≤3.25 | ||||
Elastic modulus/GPa | 270≤E≤330 | ||||
Poisson's ratio | 0.23≤μ≤0.29 | ||||
Coefficient of thermal expansion (room temperature to 500℃)/X10-6/℃ | 2.0≤α≤3.7 | ||||
Bending strength/MPa | Four-point test | ≥750 | ≥650 | ≥530 | |
Three-point test | ≥820 | ≥720 | ≥550 | ||
Vickers hardness(HV) | ≥1420 | ≥1330 | ≥1270 | ||
Fracture toughness | ≥6 | ≥5 | ≥5 | ||
Crushing load ratio | 40% | 35% | 30% | ||
microcosmic structure | Air hole/μm | ≤10 | ≤10 | ≤25 | |
Inclusion | 25<S≤50 | ≤4 | ≤8 | ≤16 | |
50<S≤100 | ≤1 | ≤2 | ≤4 | ||
100<S≤200 | 0 | ≤1 | ≤25 | ||
S>200 | 0 | 0 | ≤1 |
Ceramic product processing accuracy :
Item | Precision value | ||||
Dimensional exact values | Up to 0.001mm | ||||
Degree of finish | Up to mirror | ||||
The number of concentricities | Up to 0.003mm | ||||
The number of parallelism | Up to 0.002mm | ||||
Bore tolerance | The minimum can be machined 0.005mm | ||||
Straight groove | The narrowest machined groove is 0.1*100mm | ||||
Thickness dimension | Minimum machining to 0.08mm | ||||
Screw thread | Min machining inner thread M2, outer thread no limited | ||||
Cylindricity dimension | Up to 0.004mm | ||||
Linear tolerance | Up to 0.001mm | ||||
Min aperture | The minimum processing capacity is 0.07mm |
Applications of silicon nitride grading wheel:
Semiconductor manufacturing
Silicon nitride grading wheels can be used to flatten, thin and polish silicon wafers for the preparation of high-precision semiconductor devices.
Optoelectronics industry
silicon nitride grading wheels can be used for processing and polishing of optical components, fiber optic connectors, etc., to improve the accuracy and finish of optical devices.
Solar energy industry
The silicon nitride grading wheel can be used for polishing and brightening of solar cells to improve the conversion efficiency of solar cells.
Silicon wafer industry
The silicon nitride grading wheel can be used for polishing and glass processing of silicon wafers to improve the surface quality and finish of silicon wafers.